2022 2021 2020 2019 2018 2017 2016 2015 2014 2013 2012 2009
2022
Zhao. C, Eweis-Labolle, J., and Won, Y. Optimization of Quasi-Random Porous Structure for Thermofluidic Applications, micro Flow and Interfacial Phenomena (µFIP), June 2022, Irvine, CA, USA
Lu, D., Suh, Y., and Won, Y. Neuromorphic Deep Learning Framework for Real-Time Critical Heat Flux Prediction, micro Flow and Interfacial Phenomena (µFIP), June 2022, Irvine, CA, USA
2021
Choi, N1., Quach, N. V1., Won, Y*. A Review on the Current Industrial Uses and the Future Outlook of Battery Thermal Management Systems for Electric Vehicles, ASME InterPACK Oct. 2021, Virtual Conference.
Quach, N.V1., Kim, I2., Chang, J.H., Lee, C., Kang, U.B., Lee, J., Won, Y*. Fluorescence Microscopy Methodology for Visualizing Microscale Interfacial Defects In Packaging Materials, Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), July 2021, Virtual Conference, https://ieeexplore.ieee.org/
Suh, Y1., Zhao, C1., Won, Y. Learning droplets, bubbles, and their dynamics, International Conference on Miniaturized Systems for Chemistry and Life Sciences (mTAS), Palm Springs, CA, USA, 2021, Poster
Zhao, C1., Eweis-Labolle, J. T., Bostanabad, R., Won, Y. Data-driven optimization of porous microstructures properties through Gaussian Process, micro Flow and Interfacial Phenomena (µFIP), July 2021, Virtual Conference, Poster
Suh, Y1., Won, Y. Intelligent Vision Enables Data-driven Analysis for Pool Boiling. micro Flow and Interfacial Phenomena (µFIP), July 2021, Virtual Conference, Keynote, Student Keynote Award
2020
Quach, N.V1., Pham, Q.N1., Han, J-H., Suh, Y1., Park, J-S2., Won, Y*. Surface Engineering through Atomic Layer Deposition on Three-Dimensionally Structured Materials, ASME InterPACK 2020, October 2020, Virtual Conference, Online. DOI: 10.1115/IPACK2020-2613 PDF
Suh, Y1., Lin, C-H1., Gowda, H., Won, Y*. Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes, ASME InterPACK Conference, Oct 2019, Anaheim, CA, USA. DOI: 10.1115/IPACK2019-6372 PDF
Quach, N.V1., Pham, Q.N1., Han, J-H., Suh, Y1., Park, J-S2., Won, Y. Surface Engineering through Atomic Layer Deposition on Three-Dimensionally Structured Materials, ASME InterPACK 2020, October 2020, Virtual Conference, Online technical presentation and poster, Outstanding Poster Award DOI: 10.1115/IPACK2020-2613 PDF
Suh, Y1., Bostanabad, R., Won, Y. A deep learning framework for predicting boiling heat transfer, ASME ICNMM 2020, July 2020, Virtual Conference, Online technical presentation and poster
Suh, Y1., Lin, C-H1., Gowda, H., Won, Y. Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes, ASME InterPACK Conference, Oct 2019, Anaheim, CA, USA. Technical presentation and poster DOI: 10.1115/IPACK2019-6372 PDF
Pham, Q1., Won, Y. Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings, ASME InterPACK Conference, Oct 2019, Anaheim, CA, USA. Technical presentation and poster DOI: 10.1115/IPACK2019-6307 PDF
Lee, J1., Li, B1., Won, Y. Condensation Heat Transfer on Hierarchical Copper Inverse Opals, ASME InterPACK Conference, Oct 2019, Anaheim, CA, USA. Poster, Outstanding Poster Award
2019
Lin, C., Won, Y., Electrodeposited Porous Copper Thermal Interface Materials, ASME InterPACK Conference, Oct 2019, Anaheim, CA, USA
Montazeri, K., Lee, J., Pham, Q., Won, Y. Design of Nanostructured Surfaces for Thin-film Evaporation, ASME InterPACK Conference, Oct 2019, Anaheim, CA, USA
Suh, Y., Pham, Q., Won, Y. Evaporation Rate Measurement at the Submicron Level Using Temperature-Sensitive Fluorescence Thermometry, ASME InterPACK Conference, Oct 2019, Anaheim, CA, USA
Lee, J., Won, Y. Condensation Heat Transfer on Hierarchical Copper Inverse Opals, ASME InterPACK Conference, Oct 2019, Anaheim, CA, USA
Pham, Q., Won, Y. Patterned Porous Architectures for Pool Boiling Enhancement, ASME InterPACK Conference, Oct 2019, Anaheim, CA, USA
Lin, C., Won, Y. Electrodeposited Porous Copper Thermal Interface Materials, IEEE ITHERM Conference, May 2019, Las Vegas, NV, USA
2018
Vy Le, D., Won, Y., Evaporative Heat Transfer Phenomena on Nanostructured Surfaces. InterPACK conference, August 2018, San Francisco, CA, USA.
Montazeri, K., Pham, Q., Won, Y., Design of Evaporating Surfaces Using Highly-Ordered Microporous Structures, International Heat Transfer Conference, July 2018, Beijing, China.
Pham, Q. N., Zhang, S., Hao, S., Won, Y., Multiscale Porous Copper Architecture for Enhancing Boiling, ASME ICNMM 2018, Aug. 2018, Dubrovnik, Croatia.
Montazeri, K., Lee, H., Won, Y., Microscopic Analysis of Thin-Film Evaporation on Spherical Pore Surfaces, ASME ICNMM 2018, Aug. 2018, Dubrovnik, Croatia.
Pham, Q. N., Zhang, S., Hao, S., Won, Y., Spatially Arranged Copper Inverse Opal Architecture for Highly-ordered Flow Field in Boiling, 10th International Conference on Boiling and Condensation Heat Transfer. 2018, March 2018, Nagasaki, Japan.
Montazeri, K., Zhang, S., Qomi, MJA., Won, Y., Atomistic-level Investigations of Thin-Film Evaporation, IEEE ITHERM Conference, May 2018, San Diego, CA, USA. PDF.
Lee, J., Shao, B., Won, Y., Superhydrophobic nanoporous copper structures prepared via one-step electrodeposition for phase change process, IEEE ITHERM Conference, May 2018, San Diego, CA, USA. PDF.
Pham, Q., Zhang, S., Hao, S., Won, Y. Spatially Arranged Copper Inverse Opal Architecture for Highly-ordered Flow Field in Boiling Heat Transfer. IEEE ITHERM Conference, May 2018, San Diego, CA, USA. PDF. Best Paper Award
2017
Montazeri, K., Pham, Q. N., Won, Y., Extreme Microfluidic Evaporative Cooling through Gradient Crystalline Porous Structures, ASME IMECE 2017, Nov 2017, Tampa Bay, FL, USA.
Montazeri, K., Lee, H., Won, Y., Thin Film Evaporation Within Microscale Pores, ASME 2017 InterPACK conference, August 2017, San Francisco, CA, USA. Best Poster Award.
Lee, H., Maitra, T., Palko, J., Zhang, C., Barako, M., Won, Y., Asheghi, M., Goodson, K.E., Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer. ASME 2017 InterPACK conference, August 2017, San Francisco, CA, USA. PDF
Pham, Q., Shao, B., Won, Y. Electrochemically Etched Copper Inverse Opals: Permeability and Wettability Control. Droplet Conference, July 2017, Los Angeles, CA, USA.
Lee, J., McDevitt, K., Mohraz, A., Won, Y., Wetting Behaviors of Bijel-derived Hierarchical Nanostructures, Droplet Conference, July 2017, Los Angeles, CA, USA.
Pham, Q., Dubey, P., Montazeri, K., Won, Y. Copper Inverse Opal Architectures for Evaporative Cooling Applications. Gordon Research Conference. Jan 2017, TX, USA.
2016
Pham, Q., Won, Y. Controlled Synthesis of Porous Metal on Varying Geometric Configurations. International Conference on Micromanufacturing (ICOMM). March 2016, Irvine, CA, USA.
Dubey, P., Won, Y. Nanostructuring of Copper Surface by Solution Immersion Method. International Conference on Micromanufacturing (ICOMM). March 2016, Irvine, CA, USA.
Pham, Q., Dubey, P., Chen, K.-W., Won, Y. Nano flower and Nanograss Features on Inverse Opal Structures. Southern California Society for Microscopy & Microanalysis (SCSMM). April 2016, Irvine, CA, USA. Poster Award.
Pham, Q., Dubey, P., Chen, K.-W., Montazeri, K., Won, Y. Wetting Characteristics of Nanograss-coated Copper Inverse Opals. ASME Summer Heat Transfer Conference. July 2016, Washington DC, USA.
Pham, Q., Dubey, P., Won, Y. Patterned Graded Copper Inverse Opals for Wicking Structures. ASME Summer Heat Transfer Conference. July 2016, Washington DC, USA.
Palko, J. W., Lee, H., Agonafer, D. D., Zhang, C., Jung, K. W., Moss, J., Wilbur, J. D., Dusseault, T. J., Barako, M., Houshmand, F., Rong, G., Maitra, T., Gorle, C., Won, Y., Asheghi, M., Santiago, J. G., Goodson, K. E. High Heat Flux Two-Phase Cooling of Electronics with Integrated Diamond/Porous Copper Heat Sinks and Microfluidic Coolant Supply. IEEE Fifteen Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), June 2016, Las Vegas, NV, USA. PDF
2015
Scholl, S., Gorle, C., Houshmand, F., Liu, T., Lee, H., Won, Y., Asheghi, M., Goodson, K. E., Kazemi, H. Numerical simulation of advanced monolithic microcooler designs for high heat flux microelectronics. ASME International Technical Conference and Exhibition on Packaging (InterPACK), July 2015, San Francisco, CA, USA. PDF
Liu, T., Houshmand, F., Gorle, C., Scholl, S., Lee, H., Won, Y., Asheghi, M., Goodson, K. E., Kazemi, H., Vanhille, K. Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip. ASME International Technical Conference and Exhibition on Packaging (InterPACK), July 2015, San Francisco, CA, USA. PDF
Lee, H., Won, Y., Houshmand, F., Gorle, C., Asheghi, M., Goodson, K. E. Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT. ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), July 2015, San Francisco, CA, USA. Best paper PDF
Won, Y., Lee, H., Barako, M. T., Jung, K.-W., Zhang, C., Dusseault, T., Houshmand, F., Palko, J. W., Agonafer, D. D., Asheghi, M., Santiago, J. G., Goodson, K. E. Structure Dependent Wettability on Copper Inverse Opals. 9th International Conference on Boiling and Condensation Heat Transfer. April 2015, Boulder, CO.
Palko, J. W., Houshmand, F., Wilbur, J., Zhang, C., Dusseault, T., Won, Y., Lee, H., Barako, M., Agonafer, D. D., Jung, K.-W., Asheghi, M., Santiago, J. G., Goodson, K. E. Capillary Fed Two Phase Cooling Beyond 1kW/cm2 in Short Wicking Length, Joule‐Heated, Microporous Copper Layers. 9th International Conference on Boiling and Condensation Heat Transfer. April 2015, Boulder, CO. Best Poster Award.
Dowling, K. M., Suria, A. J., Won, Y., Shankar, A., Lee, H., Asheghi, M., Goodson, K. E., Senesky, D. G. Inductive coupled plasma etching of high aspect ratio silicon carbide microchannels for localized cooling. ASME International Technical Conference and Exhibition on Packaging (InterPACK), July 2015, San Francisco, CA, USA. PDF
2014
Won, Y., Barako, M. T., Agonafer, D. D., Asheghi, M., Goodson, K. E. Mechanical and thermal properties of copper inverse opals for two-phase convection enhancement. (pp. 326–332). IEEE Fourteen Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), June 2014, Orlando, FL, USA. PDF
Dusseault, T. J., Gires, J., Barako, M. T., Won, Y., Agonafer, D. D., Asheghi, M., Santiago, J. G., Goodson, K. E. Inverse opals for fluid delivery in electronics cooling systems. (pp. 750–755). IEEE Fourteen Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), June 2014, Orlando, FL, USA. PDF
Lopez, K., Agonafer, D. D., Won, Y., Asheghi, M., Santiago, J. G., Goodson, K. E. Geometric of Optimization of a Single Micro-pore For Phase seperation of Highly Wetting Fluids. IEEE Fourteen Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), June 2014, Orlando, FL, USA.
Agonafer, D. D., Lopez, K., Won, Y., Palko, J., Asheghi, M., Santiago, J. G., Goodson, K. E. Phase-separation of Wetting Fluids Using Nanoporous Alumina Membranes and Micro-glass Capillaries. IEEE Fourteen Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), June 2014, Orlando, FL, USA. PDF
English, T. S., Won, Y., Provine, J., Goodson, K. E., Kenny, T. W. Atomic Layer Deposited Platinum as a Sensor Material: Uniformity, 1/f Noise, and Young’s Modulus. 2014, Hilton Head. Hilton Head, USA.
Won, Y., Houshmand, F., Agonafer, D., Asheghi, M., Goodson, K. E. Microfluidic Heat Exchangers for High Power Density GaN on SiC. IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), October 2014, San Diego, CA, USA.
Cho, J., Won, Y., Francis, D., Asheghi, M., Goodson, K. E. Thermal Interface Resistance Measurements for GaN-on-Diamond Composite Substrates. IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), October 2014, San Diego, CA, USA. PDF
Agonafer, D. D., Palko, J., Won, Y., Lopez, K., Dusseault, T., Gires, J., Asheghi, M., Santiago, J. G., Goodson, K. E. Progress on Phase Separation Microfluidics. IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), October 2014, San Diego, CA, USA. PDF
2013
Won, Y., Cho, J., Agonafer, D., Asheghi, M., Goodson, K. E. Cooling limits for GaN HEMT technology. IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), October 2013, Monterey, CA, USA, Invited. PDF
Lee, J., Kodama, T., Won, Y., Asheghi, M., Goodson, K. E. Impact of Annealing on the Thermoelectric Properties of Ge2Sb2Te5 Films. MRS Proceedings, 2013.
2012
Lee, J., Won, Y., Kodama, T., Asheghi, M., Goodson, K. E., Impact of Annealing on the Thermo- electric Properties of Ge2Sb2Te5 Films, 2012 Material Research Society (MRS) Fall Meeting & Exhibit, Boston, MA, USA, 2012.
Lee, J., Kodama, T., Won, Y., Asheghi, M., Goodson, K. E. Thermoelectric and Mechanical Phenomena in Ge2Sb2Te5 Films for Phase-Change Memory. TECHCON 2012. Best in Session Award.
Won, Y., Gao, Y., de Villoria, R. G., Wardle, B. L., Kenny, T. W., Goodson, K. E. Crust removal and effective modulus of aligned multi-walled carbon nanotube films. IEEE Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), June 2012, San Diego, CA, USA.
Gao, Y., Kodama, T., Won, Y., Dogbe, S., Pan, L., Goodson, K. E., Characterization of Inhomoge- neous Mechanical Properties of Vertically Aligned Multi-Walled Carbon Nanotube Films, Thir- teenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Sys- tems (ITherm) 2012 , San Diego, CA, USA, 2012.
Lee, J., Kodama, T., Won, Y., Asheghi, M., Goodson, K. E., Thermoelectric Characterization of Ge2Sb2Te5 Films for Phase-Change Memory, Proceedings of the ASME 2012 3rd Micro/Nanoscale Heat & Mass Transfer International Conference (MNHMT), 2012, Atlanta, GA, USA, Best Paper Award.
2009
Won. Y, Milnes. D, Wang. E. N, Goodson. K. E, Kenny. T. W, 3-D Visualization of Flow in Microscale Jet Impingement Cooling System, ASME 7th International Conference on Nanochannels, Microchannels and Minichannels (ICNMM), June 2009, Pohang, South Korea.
Won. Y, Kim. S, Wang. E. N, Goodson. K. E, Kenny. T. W., Microfabricated single-jet and multi- jet device for electronic cooling, 7th World Conference on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics (ExHFT-7), July 2009, Krakow, Poland.
Won, Y., Lee, J., Wang, E. N., Goodson, K. E., Kenny, T. W. An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device. ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability (pp. 491–496), July 2009, San Francisco, CA, USA.